Making Contact with Your Plating Line | Products Finishing

21 Jul.,2025

 

Making Contact with Your Plating Line | Products Finishing

Choosing the right electrical contact system can be one of the most important decisions for a plating operation. Plating shops use high-current rectifiers and are large energy consumers. Poor power distribution and inefficient contacts are often the key factors driving large electrical losses, quality problems and costly plant shutdowns.

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Not only are contacts exposed to high electrical currents, but they also are subject to mechanical and aggressive chemical abuse. A new and clean electrical contact system may perform well, but after a year or so of use, it will perform much differently. It’s essential that the contact area transmit the current with minimal electrical loss on its way to the rack and, more specifically, to the components that are being plated or anodized in the tanks. 

Contact saddles often are specified with a simple bronze-casting V-block design, but this critical contact junction sometimes does not have a large enough surface area or electrical cross section to meet the high current requirements of the rectifier. 

New contact and power distribution systems are being designed to meet those technical demands, however, as well as to address issues of chemical corrosion and contact cleaning. No one contact design would work perfectly with every plating application, however, as there are many different tank construction and design philosophies. The most common flight bar shape, for example, is rectangular, in a variety of thicknesses and heights, and they demand specialized contacts in order to work efficiently. In some cases, extreme chemical exposure requires special consideration to ensure proper contact over a longer period of time. And the availability of adequate space for contact placement on a tank rim may also require a custom design or modification.

Considerations for a New System

There are a number of important factors to consider in selecting new contacts:

  • Amperage or current requirement.
  • Length of each cycle time.
  • Weight and dimensions of flight bars with racks.
  • Profile and dimensions of flight bars’ contact areas.
  • Special or extreme chemical exposure.
  • Possible mechanical forces.
  • Possible tank movement.
  • Available space for installation.

A fire in a plating plant is not unheard of, and many workers in these shops have smelled and felt the heat from overheated flight bars and contact saddles. It’s not uncommon for flight bars, contact saddles, base plates, cables and electrical bus bars to be warm to the touch, but hot is unacceptable, and will put the plant and personnel at high risk for injury. High heat is generated from the rectifier to the bus bars, in cables from the bus bars to the contacts, as well as in the interface between the flight bar and the contact saddle. Cables, particularly if they contain too small a cross section of copper and are inadequately sized, or if they are frayed, worn, chemically burned or have improperly crimped lugs, are many times the culprit when fire erupts.

Often, the single most critical area of high heat generation is at the point where the flight bar and the contact saddle meet during the transfer of electrical power; in the case of a V-block contact saddle and a round bar, this interface would be only two thin lines of contact. In addition to temperatures high enough to cause fires or burn employees, a great amount of energy and current are lost in travelling to the parts on the rack, and this can adversely affect the time and deposition rate of plating.

Many shops use an upside-down J channel or shepherd’s hook design at the top end of the racks’ arms for hanging off the bus bar. This is also an area of little surface contact, which leads to a reduced current flow. Rack contacts with a V design ensure that the contact area is large and consistent, easily alleviating this problem.

Spring-loaded Contacts

Spring-loaded contact systems are available for amperages ranging to 14,000 amps. These systems are based on two spring-mounted contact fingers on parallel contact halves. The distance between the spring-loaded fingers is slightly smaller than the rack, thus allowing the contact surfaces to be cleaned by abrasion. The weight of the bus bar when lifting allows it to be easily removed with little resistance from the fingers. Additionally, stainless steel covers protect the fingers from the plating chemicals while also acting as centering guides for movements such as a swinging flight bar as it enters the contact block. This contact block system is relatively inexpensive and can be designed in a variety of sizes ranging to 5,000 amps per contact block; a reinforced cast block with integrated guides for amperages to 14,000 amps also is available.

Pneumatically controlled contact blocks are the next step toward increasing current transfer. Available in a finger contact design or a plate contact design, they are designed for transferring large currents as well as for very light flight bars.

Poor contact pressure at a clamping connection combined with the cross section, material and surface condition, are the essential factors responsible for electrical resistance and power losses. Electrical resistance decreases with increased pressure, brought about by the further evolution of the contact block using hydro-pneumatic power. This allows clamping pressure as strong as 10 tons for a 5,000-amp contact at 90 psi. This clamping pressure is exponentially higher than with a spring-loaded or pneumatically controlled contact block, making them ideal for transferring current in applications ranging from 3,000 to 15,000 amps and more.

Achieving Consistent Quality

Consistent quality in any plating process is negatively affected by corrosion. Exposing contact surfaces to this environment leads to increased electrical resistance, heat-related problems and even the destruction of individual components. Optimizing automated process flow, and minimizing repair and maintenance costs requires cleaning systems. Hand cleaners can quickly clean finger contacts or other contact surfaces, and flight bar supports at the rinsing tanks can also be substituted with cleaning saddles, ensuring that the flight bar is automatically cleaned before the next plating or anodizing cycle.

Overall, specifying the correct contact saddles, rack contacts and adequately sized cable connectors are important factors in full optimization of a plating or anodizing facility. By taking the time to make an informed decision up front, shops can save time and money, and improve production in the future.

How To Design PCBs - Engineering Advice on Details - Epec's Blog

In front-end engineering, we must gather as much manufacturing information as possible from the printed circuit board data we receive. This includes customer service notes, customer emails, and the general spec, if available. Usually there is enough information to release a printed circuit board (PCB) package to manufacturing. However, I have found many gray areas that haunt our engineering department.

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Minimum Plating in Holes

Many customer drawings have a note that states: 0.001” absolute minimum plating in the holes. When I used to run a plating line, getting 0.001” in the holes was not too difficult to achieve by simply increasing the copper plating times. This would work just fine if bath agitation, copper anodes, sulfuric acid content, brightener content, and plating amps were all working correctly. Also important is the way that you rack each board before placing them in the tanks.

Now with high volume production, automatic plating lines, 0.001” absolute minimum in the holes becomes an issue. IPC Class 2 says 0.” is fine. IPC Class 3 says 0.001” average, with 0.” minimum in the holes is fine. So, hopefully PCB designers will begin to understand, that if they believe 0.001” in the holes is needed, they will realize Class 3 (medical, aerospace, mil spec) will be just fine.

Where did this 0.001” in the holes come from?

In the past, we were told to plate one ounce of copper (an ounce of copper is 0.") to every standard build. We would adjust our plating time and amperage for 1-ounce plating. Lo and behold, when quality control did microsections, the plating in the holes would be 0.” to 0.001” or more. So, this 0.001” number generally meant, plate an ounce of copper.

To help avoid confusion, a better statement would be plate 0.001” average in the holes.

Automated PCB Plating Lines

PCB Surface Finishes

Another stumbling point are PCB surface finishes. Many military specification and aerospace drawings (often appearing to have been drawn in prehistoric times) will say follow copper with 0.” of tin lead 60/40. A long time ago we would rinse the circuit boards after copper plating, clean them in acid, and then throw them in the electrolytic tin lead tank for time. The longer you left them under amperage, the more tin lead you would get. Eventually the circuit board industry moved away from using lead-based finishes as much.

Along came RoHS surface finishes and HASL that use less lead. You will not get 0.” tin lead plated from HASL. No one uses old tin lead plating anymore.

Now, drawings will typically say 3u (millionths) gold for an ENIG surface finish. The origins of this are unknown but the general line of thinking for this was perhaps that more is better. However, IPC says 1.9u minimum is fine. ENIG is an immersion process, immersion baths plate very quickly to a surface but will not accumulate thickness very well no matter how long you leave a board in the tank. It is only a chemical process without electrolytic help. The coverings are complete but thin and still okay since solderability is the end goal anyways. You don’t need 3u, 5u, or 14u gold - 1.9u coverage will work just fine for most designs.

Immersion tin is the same. It looks great if you do not touch it, works well too, but is generally a very thin covering.

Circuit Board Copper Weights

Copper weights are another nightmare that shouldn’t be. Most PCBs need one ounce of finished copper. What this means is that internal layers will have one-ounce copper foil, usually not quite one ounce, while outer layers will start at half ounce with standard plating added. Standard plating these days on automated lines will give you a 1-ounce finish and 0.” in the holes. Just fine again from IPC.

The problem in front end engineering is many PCB drawings are not clear as to finished copper weight. Stack-ups may say 1-ounce copper. Alright, is it finished or starting?  A lot of commercial drawings mean finished, Mil spec drawings mean starting.

The important takeaway here is to state whether it is finished or starting copper on the stack-up.

PCB Material

Most circuit board drawings say G10 or FR4 for a material callout. Typically, we use FR4. A little notation is needed on the drawings to specify which laminate material you’d like i.e. Tg130 (standard FR4), Tg170, or Tg180. It is also alright to call out the IPC specific numbers which refer exactly to the required Tg temperature. Most drawings are fine.

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Summary