IWATA, May 28, - Yamaha Motor Co., Ltd. (Tokyo: ) announces the release of its new S10 and S20 i-PULSE 3D HYBRID SURFACE MOUNTERS with enhanced support for MID's (Molded Interconnect Devices) from September 1, .
The S10 and S20 have been developed under the concept of a single unit Manufacturing Center designed for surface mounting, dispensing and inspecting. In addition to having superior product loading speed and accuracy as well as highly versatile mounting options from ultra-small chips to large components, these models are hybrids with their mounting heads and dispensing heads intermingled allowing alternate dispensing and mounting. The S10 and S20 are more advanced models than the existing M10 and M20 offering improved flexibility, expandability and productivity.
Through a newly developed tilt mechanism unit and a long stroke on the Z axis in the S10 and S20 models, surface mounting is now possible on concave-convex, sloped and curved surfaces bringing enhanced expandability to suit production types over and above conventional flat board types. Head variation can also be set to a 6-axis 6-theta, or 12-axis 2-theta configurations. Cost performance is further enhanced through improved in placement capability. In addition, stable dispensing and inspecting is carried out thanks to the adoption of a color fiducial mark recognition camera and newly developed lighting units.
The S20 will be on display at the JISSO PROTEC (17th Jisso Process Technology Exhibition) at the Tokyo Big Sight, Japan (Koto-ku, Tokyo) from June 3-5.
If you want to learn more, please visit our website KF-SMT.
The market expansion in recent years for products that incorporate control boards such as smart phones and tablet devices, electric cars, natural energy power generation, and LED lighting are becoming more highly integrated, lightweight, thinner and smaller. In addition to this, increases are also being seen in further low- cost reduction, diversity, and a wider range of applications available.
Within the production processes required for control board manufacture, in order to achieve lightweight, compactness and high performance coupled with lower costs, changes are being seen from the conventional two-dimensional placement (flat-surface) to three-dimensional placement, and three-dimensional capability is being further down-sized and adopted in the SMT (surface mounting) fields.
By launching the S10 and S20 with even higher flexibility and productivity in their hybrid capability, we can provide more flexible support for 3D MID (Molded Interconnect Device), which can lead to greater cost-cutting through a reduction in the number of components and man-hours required in assembly work, and will result in smaller and thinner products as well as meeting a wider range of user needs in mounting, as a way to create and expand our own market.
Concave-convex, sloped and curved surface mounting achieving the possibility for the manufacture of new 3D MID (Molded Interconnect Device) are now achievable thanks to a longer stroke on the Z-axis, and Yamaha's original optimal design for its newly developed cast iron frame and tilt mechanism unit. This feature surpasses the framework of conventional SMT bringing enhancement for 3D MID processes.
Hybrid placement carried out alternately for dispensing and component placement processes is achieved due to the mounting head and dispensing head being combined that allows design changes to be fitted on to each axis according to production requirements. In addition, cavity board* work becomes easier with the adoption of non-contact dispensing.
*Boards that are not flat and therefore making them more difficult to work with in solder-paste applications due to their surfaces being uneven.
More stable dispensing inspection is carried out by the adoption of a color camera and a newly developed lighting unit. Solder-paste dispense > dispense dot check > and component placement processes can now all be carried out using one machine thanks to these adaptations.
Two types of head units are available, the 6-axis 6-theta unit (standard type), or the 12-axis 2-theta head unit (high performance type). Improved placement capacity and higher cost effectiveness is achieved due to the newly developed cast iron frame with lighter moving parts.
A maximum capability for long board sizes of up to mm x 635mm (optional) or a maximum board size of up to mm x 510mm for one-time clamping is possible. For example, significantly greater productivity is achieved by adjusting to suit a 12-axis 2-theta head unit when manufacturing long size LED boards.
A wide range of components from ultra-small (0.25x0.125mm) chips to larger components up to 120 x 90mm can be handled. The unit is also capable of a component height for mounting of up to 35mm, the largest in the class.
The maximum feeder lane in 8mm tape conversion is 180 types (45 types x 4 units) for the S20, and 90 types (45 types x 2 units) for the S10.
The F3 (electric feeder) feeder bank changer has the newly developed CFB-45E providing an increase in the number of feeder lanes available. Thanks to compatibility with existing M10 and M20 models, efficient use of existing feeder bank changers is possible including the existing CFB-36E, the CFB-36 F1/F2 (mechanical feeders) feeder bank changers, and the CTF-36C removable type tray feeder.
It is also able to replace the CTF-36C removable type tray feeder. Furthermore the CFB-45E, CFB-36E, and the CFB-36 can be used all at the same time within a system.
Starting as the IM Business Unit established in the s, Yamaha SMT has continued to evolve with its customers.
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YMS
A full vision mounter that adopts strobe lighting and a high-speed vision system
Featuring both the laser sensor and the vision system for the first time in the world, the YVL80 was renowned as an innovative multi-purpose mounter.
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As compilations of previous technologies, the products achieved even higher efficiency through the full vision technology for recognizing all components on a multi-vision camera. The YV100 and YVL88, which were referred to as the KM series, were widely accepted by the market and Yamaha established its position as a top manufacturer of medium-speed mounters by that time.
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The YV100X and 88X proposed the "High-speed mounter" concept to the market where large rotary mounters were the mainstream. This module concept is still the driving force for Yamaha mounters to make advances today.
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Yamaha develops a full-vision (image recognition) type solder paste printer, the YVP, that seamlessly integrates with its surface mounters.
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Starting to install Microsoft Windows, the product adopted the Multiple Accuracy Compensation System (MACS), which is the foundation of the current Yamaha mounter quality. The YV100Xg established Yamaha market position as high-speed, high-quality, compact, and low-price modular mounters, which led to the survival and subsequent rapid progress in Yamaha's SMT business.
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The hybrid placer i-CUBE was developed as a mounter for hybrid mounting of bare chips, flip chips, and other IC chips in addition to surface-mounted components (SMD) to assemble parts for a quartz oscillator, SAW filter, and parts for mobile as well as devices such as IC packages. The i-CUBE is a popular product to the present day.
The Multiple Accuracy Compensation System (MACS) developed for compensation of the component mounting acuracy of a mounter was applied to printers to realize high quality printing. The product was a major hit and drove rapid growth in Yamaha printers.
Production support software (optional function group called "IT Option") that provides improved operating rates and enhanced quality control, in addition to drawing out the performance of the equipment itself, was developed to support production on a mounting line.
A pioneering equipment was developed for mounting inspection and traceability, which are the core of Yamaha's "1 Stop Smart Solution" concept.
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If you want to learn more, please visit our website I-Pulse Smt Feeder.
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The SS Feeder realizes excellent component supply speed and high component positioning accuracy by adopting a newly developed microcomputer controlled ultra-thin motor. This allowed Yamaha SMT to support traceability based on high accuracy mounting with the feeder and to secure next-generation quality.
The "compact, high-speed modular" concept was a major hit and the YS12 continued to be Yamaha SMT's top selling item for the next ten years. The YS88 and YS100 were subsequently put on the market as YS series products.
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As a manufacturer that handles a full lineup of SMT equipment, Yamaha SMT developed a platform for linking the inspector and the mounter to collect and analyze a wide range of effective information from the entire SMT process. "QA Option" was born as software that supports customers working on quality issues. This has continued to be a production support system that serves the core of Yamaha's "1 Stop Smart Solution" to the present day.
An AOI was put on the market along with printers and mounters for quality assurance of the SMT process. By combining IT Option, QA Option, and other production support systems, Yamaha's "1 Stop Smart Solution" proposal took off in earnest.
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This was the turning point at which Yamaha SMT, which began with medium-speed mounters, started being called "No.1 in the world."
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As Yamaha's first 4-beam 4-head layout machine, Yamaha SMT launched a mounter featuring the world's highest level of productivity. A newly developed "ZS Feeder" that supports Z:TA's high speed pick-up was also put on the market.
Yamaha SMT merged with i-PULSE, a company renowned for its multi-purpose mounters for Odd-shape components, which had produced models such as the M10 and M20. The tenacity of i-PULSE's enthusiastic engineers was added to Yamaha family.
The YSi-V was put on the market. It was a breakthrough in terms of Yamaha SMT's process inspection systems. With its repeatability enabled by the high rigidity body used for mounters and system performance that will not miss failures in various 2D /3D inspections, the YSi-V rapidly increased Yamaha's market share.
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The Z:LEX YSM20 is a high efficiency modular mounter that has the versatility to flexibly and efficiently support different types of production for various items and the world's fastest mounting performance in its class. Featuring the world's highest productivity in High-Mix production, the Z:LEX YSM20 brought about a giant leap for the world's high-speed multi purpose mounters.
Yamaha SMT merged with the Σ series from the Hitachi High-Tech Group, a company renowned for the F8 and the G5. From collaboration work with Sigma engineering team and service members who are involved in the development and maintenance of ultra-high-speed mounters, Yamaha's technological development capability was further strengthened.
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The S10 and S20 were developed with the concept of a “manufacturing center” with which mounting, dispensing, and inspection can all be performed in one unit. With their excellent component mounting speed and accuracy, flexibility for mounting ultra small chips to large components, and a head that combines a mounting head and a dispensing head, the S10 and S20 were the culmination of our relentless pursuit for the next level. They feature the highest level of flexibility, which allows “hybrid mounting,” or alternately performing dispensing and mounting components.
The Z:LEX YSM20W realized high-speed, high-precision dual-lane mounting on boards exceeding 300 mm in width for the first time in the world in the global trend of dual-lane mounting.
Yamaha SMT finally succeeded in developing a modular mounter that achieves the world's highest speed of 200,000 CPH. Yamaha SMT, which started as a medium-speed mounter manufacturer finally became one of the best mounter manufacturers in the world.
Intelligent Factory is an integrated system that uses cutting-edge IT technologies to integrate Yamaha's production system with support software and makes any factory smart by linking between SMT equipment, lines, a host, MES, ERP system, and so on. Combined with the synergy effect of Yamaha's "1 Stop Smart Solution," it allows you to build a high-efficiency sophisticated linked system with no black box.
In addition, thanks to its construction as a group of function-specific packages, Intelligent Factory can be efficiently introduced according to the necessary functions or budget without overextending oneself.
An SPI, a missing piece in the comprehensive proposal for the SMT process, was put on the market. The YSi-SP enabled Yamaha to make proposals on all kinds of equipment except conveyors and reflow oven, completing a comprehensive SMT process solution as "1 Stop Smart Solution."
As the demand for power saving and labor saving in the SMT process grows, the "Auto Loading Feeder," "New Auto Tray Station (ATS) for pallet replacement without stopping the production run ," and "Intelligent SMD Storage System" were successively put on the market as solutions for reasonable component supply.
This promoted the vision of Yamaha SMT that advances as a total solution provider of the SMT floor as well as the SMT line to the world.
By fully automating set-up change work best suited for multiproduct production and with Yamaha's unique high precision printing, an innovative new product that is part of the SMT floor solution was completed.
With the aim of providing a comprehensive solution beyond the expectations of customers as a turnkey provider for post-processing of semiconductors by integrating influential technologies of companies: the surface mounter and industrial robotics businesses of Yamaha Motor, bonding equipment of Shinkawa, and molding equipment of APIC Yamada, Yamaha Motor Robotics Holdings (YMRH) was established as a new company.
This has led to Yamaha Robotics becoming the only business entity in the world that can provide consistent solutions for post-processing to SMT processing of semiconductors and then to the subsequent assembly process (FA system) in one
* Company name changed on July 1, , to Yamaha Robotics Co., Ltd (YRC)
The YRM20 is a premium high-efficiency modular mounter featuring two types of heads: the newly developed high-speed, multi purpose rotary head that achieves the world's fastest mounting capacity in its class (RM head) and the newly designed in-line head featuring high speed and high flexibility with the "one head solution" (HM head). This is a modular mounter that makes production possible with the highest efficiency in the world in High-Mix production and the YRM20 is expected to bring about a crucial breakthrough in the world in the near future.
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Hybrid placer ideal for mixed mounting of SMD and wafer components in just a single unit. YRH10 drastically boosts productivity and mounting accuracy reaching a bare chip mounting speed of 10,800 CPH and ±15 μm accuracy when supplying wafers. The YRH10 has vastly boosted compatibility with all types of multi-chip modules and IC packages. This hugely impacts not only surface mounting technology but also the entire semiconductor industry.
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