In addition to the dissolving power of the cleaning solution, the cleaning efficiency can be improved by applying physical force. Most of the current flux cleaning systems use one of the following methods.
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A method in which the cleaning workpiece is immersed in a cleaning agent and the flux is removed by the dissolving power of the cleaning agent. Simply immersing the workpiece in the cleaning agent does not diffuse the dissolved flux, so it is often used in conjunction with physical force, such as the following
A method in which a cleaning agent circulated by a pump or similar device is sprayed onto a workpiece immersed in the liquid. Relatively uniform results can be obtained throughout the cleaning tank. The turbulent flow effect can be used to promote diffusion more effectively.
A method of removing contaminants through cavitation and acceleration by propagating ultrasonic waves through the cleaning solution. It is very effective for removing solder balls. Some cleaning workpieces may be damaged by ultrasonic waves, but by adjusting the frequency and output power, flux removability can be improved while minimizing damage.
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A method of cleaning in which the cleaning agent is sprayed onto the workpiece like a shower.
The advantages of this system are that it can be used with most cleaning agents* and that flux removal can be improved by increasing the injection pressure.There are some disadvantages: for highly volatile cleaning agents, measures such as sealing the equipment are necessary; increasing the injection pressure has a large impact on the cleaned workpiece; the cleaning agent is misted, leading to volatilization loss; and cleaning performance is poor in areas not exposed to the shower.
* We do not recommend the use of cleaning agents with low flash point or those classified as hazardous materials.
A cleaning method in which the cleaning agent vapor is liquefied (condensation) on the workpiece, and the liquefied cleaning agent flows down while dissolving the flux on the workpiece surface.
This cleaning method is used with chlorinated (trichloroethylene, methylene chloride, etc.), fluorinated (HFE, HFC, etc.), silicon, brominated solvents, and alcohols. It can also be used with hydrocarbon-based cleaners in a vacuum environment.
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