The Advantages And Disadvantages Of Several Common PCB Boards

with the evolution of the times, technological progress, environmental protection requirements, the electronics industry also with the times of the wheel active or forced to move forward, the technology of the circuit board is not so. Here are several circuit board surface treatment is currently more common process, I can only say that there is no perfect surface treatment, so there are so many choices, each surface treatment has its own advantages and disadvantages, the following interview to list.

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Advantages: 

low cost, flat surface, good solderability (in the case of no oxidation yet).

Disadvantages: 

easy to be affected by acid and humidity, can not be stored for a long time, after unpacking need to be used up within 2 hours, because the copper is exposed to the air easily oxidized; can not be used for double-sided process, because after the first reflow the second side has been oxidized. If there are test points, solder paste must be added to prevent oxidation, otherwise the subsequent contact with the probe will not be good. 

Advantages: 

can get a better Wetting effect, because the coating itself is tin, the price is also lower, good soldering performance.

Disadvantages: 

Not suitable for soldering fine gap feet and too small parts, because the surface flatness of the spray tin plate is poor. In the PCB process is easy to produce tin beads (solder bead), the fine pitch (fine pitch) parts easier to cause a short circuit. When used in the double-sided SMT process, because the second side has been the first high-temperature reflow soldering, it is very easy to melt the spray tin again and produce tin beads or similar water droplets by gravity into drops of spherical tin spots, resulting in a more uneven surface and thus affect the soldering problem.

Advantages: 

not easy to oxidize, can be stored for a long time, the surface is flat, suitable for soldering fine gap feet and solder joints of smaller parts. Preferred for circuit boards with key lines (such as cell boards). Can be repeatedly reflowed many times is not likely to reduce its solderability. It can be used as a substrate for COB (Chip On Board).

Disadvantages: 

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Higher cost, poorer solder strength, easy to have black pad/black lead problem because of using electroless nickel process. The nickel layer will oxidize over time, and long-term reliability is a problem.

Advantages: 

Has all the advantages of soldering bare copper boards, and expired (three months) boards can be re-surfaced, but usually in one pass.

Disadvantages: 

Easily affected by acid and humidity. When used in secondary reflow, it needs to be completed within a certain time, and usually the second reflow will be less effective. If stored for more than three months, it must be re-surfaced. OSP is an insulating layer, so the test point must be printed with solder paste to remove the original OSP layer in order to contact the pin point for electrical testing.

Printed Circuit Board (PCB) assembly is the linchpin of modern electronics, underpinning the performance, cost-efficiency, and dependability of every electronic device we rely on. Choosing the right assembly technology is paramount to a product’s success. The two dominant methods in the industry are Surface Mount Technology (SMT) and Through Hole Technology (THT), each with unique strengths and weaknesses that make them better suited for different applications. Whether you’re a seasoned professional or new to the field, understanding these technologies is crucial to navigating the complexities of PCB assembly and achieving optimal outcomes.

PCB assembly has evolved significantly since its inception. Through Hole Technology (THT) was the standard method from the s to the s. With the advent of smaller, more complex electronics, Surface Mount Technology (SMT) emerged, becoming dominant by the late 20th century.

THT was instrumental in early electronics, providing robust connections for components. THT played a pivotal role in the early days of electronics, offering reliable and sturdy connections for components. However, as technology advanced, the demand for smaller and more feature-rich devices grew exponentially. This push towards miniaturization and increased functionality, along with the desire for multilayer PCBs and higher component densities, paved the way for the development and widespread adoption of SMT. This innovative technology quickly became the go-to choice for manufacturers seeking to create compact, high-performance products without sacrificing reliability or functionality.

While SMT is the preferred choice for most modern electronics due to its efficiency and cost benefits, THT remains relevant for specific applications requiring robustness and high-power handling.

While SMT dominates modern electronics manufacturing due to its efficiency and cost benefits, THT remains indispensable in sectors prioritizing robustness and high-power handling. Notably, the automotive industry relies on THT components for powertrain systems, safety-critical electronics, and modules subjected to harsh conditions. Similarly, the aerospace sector utilizes THT for its proven reliability in extreme environments, particularly in avionics, navigation systems, and communication equipment. THT also finds extensive use in the industrial sector for heavy machinery, power distribution, and high-voltage applications. Furthermore, THT is favored in audio amplifiers, high-end musical equipment, and certain medical devices where signal integrity and durability are paramount.

The future of SMT is promising, with ongoing advancements pushing the boundaries of miniaturization, component density, and automation. The emergence of smaller, more powerful chip packages, coupled with high-speed pick-and-place machines and sophisticated inspection techniques, will enable the creation of increasingly complex and compact electronic devices. The integration of flexible PCBs will revolutionize wearable electronics, medical implants, and flexible displays. Additionally, 3D printing technology is poised to transform prototyping and low-volume production, allowing for rapid design iteration and customization.

THT, while not experiencing the same rapid evolution as SMT, continues to evolve. The development of hybrid technologies that seamlessly integrate SMT and THT components on the same board is gaining traction, enabling designers to leverage the strengths of both technologies strategically. Additionally, ongoing research into new THT materials and soldering techniques may lead to improved performance and reliability in demanding applications.

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