Titanium (Ti) is a widely used material in industries requiring high strength, lightweight properties, and exceptional resistance to extreme temperatures and corrosion. Titanium sputtering targets, commonly used in physical vapor deposition (PVD) processes, play a crucial role in producing thin films for various applications. This article explores the properties, advantages, and applications of titanium sputtering targets, emphasizing their ability to perform under high temperatures. For a comprehensive comparison of materials that excel in similar environments, refer to Top 10 Sputtering Target Materials That Can Withstand High Temperatures.
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Titanium stands out due to its unique combination of physical and chemical properties, making it an excellent choice for high-temperature sputtering applications:
During sputtering, the target material is bombarded by high-energy ions, causing atoms to eject and deposit as a thin film on a substrate. This process generates significant heat, making thermal resistance critical. Titanium sputtering targets meet this challenge by:
Titanium sputtering targets are used in various industries for their ability to produce robust, high-performance thin films. Some key applications include:
Titanium sputtering targets offer several benefits for industries requiring high-performance materials:
When selecting a titanium sputtering target, consider the following factors:
Titanium sputtering targets are indispensable for industries that require materials capable of withstanding high temperatures, corrosion, and physical stress. Whether used in semiconductors, optics, aerospace, or medical applications, titanium ensures the production of high-quality thin films with superior durability and performance.
Stanford Advanced Materials (SAM) provides high-quality titanium sputtering targets designed to meet the diverse needs of various industries. With a commitment to precision and reliability, SAM ensures that your thin-film deposition processes achieve exceptional results. For more information on high-temperature sputtering materials, explore Top 10 Sputtering Target Materials That Can Withstand High Temperatures.
Read more: Everything You Need to Know About Titanium Sputtering Target
Molybdenum (Mo) is a widely used material in sputtering targets because of its unique properties, especially its ability to handle extreme temperatures. In industries that require high-temperature stability and precise material deposition, molybdenum sputtering targets provide a reliable solution. This article explores why molybdenum is favored in sputtering processes and how it performs under intense heat conditions. For further insights into other materials that can withstand high temperatures, you can refer to SAM’s article titled “Top 10 Sputtering Target Materials that Can Withstand High Temperatures.“
Molybdenum is a metal known for its high melting point, excellent thermal conductivity, and strength. It belongs to the group of refractory metals, which are characterized by their ability to withstand high temperatures. Molybdenum is widely used in electronics, aerospace, and other high-tech industries. Its high melting point of 2,623°C makes it a perfect choice for sputtering targets in applications where heat resistance is essential.
Sputtering is a process used to deposit thin films of material onto surfaces. This is done by bombarding a target material with ions, causing atoms to be ejected from the target and deposited onto a substrate. Molybdenum sputtering targets are often selected for their ability to endure the physical stress of ion bombardment without breaking down.
Additionally, molybdenum’s thermal stability ensures that the target material remains consistent during the sputtering process, even at high temperatures. This makes it ideal for industries where precise control over thin film deposition is critical.
One of the most important features of molybdenum is its high-temperature resistance. Molybdenum sputtering targets can endure extreme heat without melting or degrading, which is essential in many industrial processes. Molybdenum can maintain its structural integrity even when exposed to temperatures close to its melting point.
In industries like semiconductor manufacturing, where heat can easily exceed 1,000°C, molybdenum’s stability ensures the sputtering process remains efficient and accurate. This high-temperature performance also makes molybdenum suitable for the production of solar cells, flat-panel displays, and other devices that require thin-film coatings under intense heat.
Molybdenum is not only heat-resistant but also extremely durable. It has a high resistance to corrosion and wear, meaning that sputtering targets made from molybdenum have a long lifespan. This durability reduces the need for frequent replacements, making it cost-effective for industries that rely on continuous and efficient production processes.
Moreover, molybdenum sputtering targets are known for their ability to maintain a high level of performance over time. Even when exposed to repeated ion bombardment, molybdenum retains its effectiveness, delivering consistent results.
Molybdenum sputtering targets are used in various industries that rely on thin-film deposition. Some of the most common applications include:
Molybdenum’s thermal stability is another key reason it is favored for sputtering targets. It remains stable even when subjected to rapid temperature changes, ensuring consistent deposition rates and high-quality thin films. This stability is especially important in processes where precise control over temperature is critical to the success of the deposition.
In addition to its thermal stability, molybdenum has excellent thermal conductivity. This allows heat to be efficiently dissipated during the sputtering process, preventing the target from overheating. By keeping the temperature under control, molybdenum sputtering targets help maintain the quality of the thin film and avoid any defects caused by excessive heat.
While molybdenum has many advantages, it also presents some challenges. The material’s hardness can make it difficult to machine into sputtering targets, which may increase production costs. Additionally, because molybdenum is less ductile than other metals, it may be more prone to cracking if not handled carefully during manufacturing.
However, these challenges are typically outweighed by the benefits of using molybdenum in high-temperature applications. Its strength, thermal stability, and durability make it a valuable material for industries where performance and precision are key.
Molybdenum sputtering targets are a crucial material for industries that require high-temperature resistance and durability. Whether used in semiconductors, solar panels, or aerospace components, molybdenum provides consistent performance and long-lasting reliability. Its ability to withstand extreme temperatures, resist corrosion, and maintain stability makes it an ideal choice for sputtering applications.
If your industry demands sputtering targets that can handle tough conditions, molybdenum is an excellent option. Stanford Advanced Materials (SAM) offers high-quality molybdenum sputtering targets that meet the demands of various industries. With a focus on precision and performance, SAM ensures that their molybdenum products provide reliable solutions for your thin-film deposition needs.
3D printing, or additive manufacturing, has transformed the way we conceive and produce complex components across a variety of industries. At the heart of this technological revolution lies the use of metal powders, enabling the creation of parts with intricate geometries and properties that were once deemed impossible. Metal materials used as 3D printing powders not only offer remarkable versatility in application but also provide strength, durability, and functionality to printed objects. From aerospace components to bespoke medical implants, the choice of metal powder is critical in defining the success of the final product. This article delves into the most commonly used metal materials in 3D printing, shedding light on their properties, applications, and the future they promise in additive manufacturing.
Titanium alloys are among the most coveted materials in 3D printing, prized for their exceptional strength-to-weight ratio, corrosion resistance, and biocompatibility. These alloys, particularly Ti6Al4V, have found widespread application in the aerospace industry for manufacturing lightweight yet durable components. Moreover, their biocompatibility makes titanium alloys an ideal choice for medical implants, such as hip replacements and dental fixtures, enabling personalized healthcare solutions. The ability to print parts from titanium alloy powder has opened new avenues for designing and engineering parts that achieve optimal performance while minimizing material waste.
Stainless steel powders are extensively used in 3D printing due to their robustness, corrosion resistance, and excellent mechanical properties. This group of steel alloys is suitable for a wide range of applications, from automotive parts to industrial tools and consumer products. The versatility of stainless steel allows for the production of parts that require high strength and durability, along with resistance to rust and oxidation. Industries value stainless steel 3D printed components for their longevity and reliability, making it a staple material in additive manufacturing for functional prototypes and end-use parts.
Aluminum alloys, known for their lightweight and high-strength characteristics, are increasingly popular in 3D printing. These materials are particularly appealing in the automotive and aerospace sectors, where reducing weight without compromising strength is a perpetual goal. Aluminum’s excellent thermal conductivity and resistance to corrosion further enhance its suitability for manufacturing components like engine parts, aircraft fittings, and satellite components. The development of aluminum alloy powders for additive manufacturing has enabled the creation of complex, lightweight structures that contribute to energy efficiency and performance improvements in various applications.
Cobalt chrome stands out in 3D printing for its high wear resistance and ability to withstand extreme temperatures. This alloy is predominantly used in the medical and dental fields for prosthetics, dental implants, and orthopedic implants due to its strength, biocompatibility, and resistance to corrosion. Cobalt chrome’s durability also makes it suitable for aerospace and automotive applications, where components must endure harsh operational conditions. The precision and reliability of cobalt chrome parts produced through additive manufacturing are unparalleled, meeting the strict standards required in medical and aerospace industries.
Nickel alloys, such as Inconel, are essential in 3D printing applications that demand resistance to high temperatures and corrosive environments. These alloys are widely used in aerospace, automotive, and energy sectors, particularly for components exposed to extreme conditions, such as turbine blades and exhaust systems. Nickel alloys’ exceptional thermal and mechanical properties ensure the performance and longevity of parts in challenging operational scenarios. Additive manufacturing with nickel alloy powders allows for the design and fabrication of complex, high-performance components that traditional manufacturing methods cannot achieve.
The use of metal powders in 3D printing has significantly expanded the horizons of additive manufacturing, offering unprecedented opportunities for innovation across industries. From the lightweight and strong titanium alloys to the durable and corrosion-resistant stainless steel, each metal material brings unique properties and advantages to the table. As additive manufacturing technologies continue to evolve, the exploration and adoption of diverse metal materials will play a crucial role in pushing the boundaries of design, performance, and functionality in manufactured parts. The future of 3D printing shines brightly, powered by the versatility and capabilities of metal materials used as printing powders.
Further Reading: Metal Powder Materials Used in 3D Printing – A comprehensive Guide
The discovery of germanium, a metalloid with unique properties that make it crucial in semiconductors and electronics, is a fascinating story that intertwines scientific prediction, diligent research, and a bit of serendipity. This narrative begins with Dmitri Mendeleev, the Russian chemist who, in , formulated the Periodic Table of Elements. Mendeleev’s version of the periodic table was based on the properties of known elements and their atomic weights, and it allowed him to predict the existence of several unknown elements, including one he named “ekasilicon.”
Mendeleev’s predictions for ekasilicon included its atomic weight, density, and certain chemical properties. He estimated that the atomic weight of ekasilicon would be about 72 and that it would possess properties similar to those of silicon, due to its placement in the periodic table. This prediction laid the groundwork for the actual discovery of germanium.
The credit for discovering germanium goes to the German chemist Clemens Winkler. In , while analyzing a mineral called argyrodite from a mine near Freiberg, Saxony, Winkler isolated a new element that matched Mendeleev’s predictions closely. Winkler named the new element “germanium” (from Latin “Germania” for Germany) in honor of his homeland. This discovery was not only a significant addition to the periodic table but also a remarkable validation of Mendeleev’s theoretical framework, demonstrating the power of scientific foresight.
The history of germanium is not just about its discovery; it also encompasses its impact on technology and industry. Initially, germanium was considered a relatively unimportant element. However, its significance increased dramatically in the mid-20th century with the development of the semiconductor industry.
Germanium became a key material in the manufacture of transistors and diodes, crucial components in the burgeoning field of electronics. This marked the beginning of a new era in which germanium played a central role in the advancement of technology, from the development of the first electronic computers to its use in fiber optic systems and infrared optics.
Over time, silicon largely replaced germanium in semiconductor devices due to silicon’s abundance and lower cost. Nevertheless, germanium remains important in niche applications such as infrared optics, polymerization catalysts, and as a semiconductor material in certain high-speed electronic and photonic devices. The story of germanium, from its prediction and discovery to its role in modern technology, illustrates the interplay between theoretical science and practical application, highlighting how a single element can significantly impact our understanding of the natural world and technological advancement.
In crafting a comprehensive account of germanium’s discovery and history, one would delve into the scientific, technological, and economic contexts that have shaped its journey. This includes exploring the challenges and breakthroughs in understanding and manipulating germanium, its competition with other materials, and its enduring legacy in science and industry. Through this exploration, the narrative would not only chronicle the discovery and applications of germanium but also reflect on the broader themes of innovation, discovery, and the human quest to understand and utilize the elements.
Germanium stands out due to its unique properties. It is a metalloid, which means it has properties of both metals and non-metals. Germanium has an atomic number of 32 and is located in group 14 of the periodic table, the same group as carbon, silicon, tin, and lead. It has a lustrous, grayish-white appearance and is brittle at room temperature.
One of the key characteristics of germanium is its semiconductor properties. Unlike metals, which conduct electricity freely, and insulators, which do not conduct electricity, semiconductors like germanium can conduct electricity under certain conditions. This property is crucial for the functionality of electronic devices.
Germanium also has a high refractive index and low optical dispersion, making it valuable for optical applications like lenses and infrared optics. Its ability to form stable organic compounds is utilized in polymerization catalysts and the pharmaceutical industry.
The applications of germanium span various fields, from electronics to optics. Initially, germanium’s role in the semiconductor industry marked a technological revolution. It was used in the production of the first transistors and diodes, playing a pivotal role in the development of electronic computers, telecommunications, and radar.
In the realm of optics, germanium’s excellent infrared properties make it an ideal material for night-vision devices and thermal imaging cameras. Its transparency to infrared light is utilized in fiber optic systems, improving the efficiency of data transmission.
Another significant application of germanium is in the creation of germanium sputtering targets. Sputtering targets are materials used in a process called sputtering, a method of depositing thin films of materials onto surfaces. Germanium sputtering targets are used in the manufacturing of semiconductors and coatings for optical components, where the unique properties of germanium are required.
Read more: Everything You Need to Know About Germanium Sputter Target
From its predictive discovery to its widespread application in modern technology, germanium has played a pivotal role in advancing human understanding and technological capabilities. Its unique properties have enabled breakthroughs in electronics, optics, and renewable energy, demonstrating the critical role of materials science in shaping the future. As researchers continue to explore and innovate, the story of germanium serves as a reminder of the endless possibilities that await discovery in the periodic table, promising new solutions to technological challenges and opening doors to future advancements.
In the domain of advanced materials science, particularly in the fabrication of thin films, the unique properties of germanium sputtering targets are of paramount importance. These targets, integral to the sputtering process used in the production of semiconductor and optical devices, leverage the distinct characteristics of germanium to achieve superior performance. This article delves into the properties of germanium sputter targets, highlighting the attributes that make them essential for cutting-edge technological applications.
A key property that stands out is the semiconducting nature of germanium sputter targets. Germanium, with its favorable band gap, provides excellent electron mobility, which is crucial for the efficient operation of semiconductor devices. This semiconducting property is instrumental in the precise control over the electrical conductivity of thin films, a critical aspect in the manufacturing of electronic components.
The optical properties of germanium sputter targets also contribute significantly to their utility. The high refractive index and low optical dispersion of germanium make it an ideal material for infrared applications, allowing for the production of thin films that efficiently transmit infrared light. These properties are particularly beneficial for the development of infrared optics, thermal imaging systems, and other devices relying on superior optical performance.
The ability to achieve high levels of purity and uniformity is another hallmark of the properties of germanium sputter targets. In the sputtering process, the quality of the deposited film is heavily dependent on the purity of the target material. Germanium targets can be produced with minimal impurities, ensuring that the resulting films are of the highest quality. Uniformity in film thickness and composition is equally critical, affecting the performance and reliability of the finished product.
Germanium sputter targets are renowned for their thermal and mechanical stability. These properties are crucial for maintaining the integrity of the target material under the high-energy conditions of the sputtering process. The robust nature of germanium ensures that sputter targets can withstand the rigors of prolonged use, contributing to consistent film quality and extending the lifespan of the targets.
The unique properties of germanium sputter targets—ranging from their semiconducting and optical characteristics to their exceptional purity, uniformity, and stability—make them invaluable in the realm of material science and thin-film technology. These properties enable the production of high-quality films that are integral to the performance of semiconductors, optical devices, and a host of other technological applications. The ability to tailor the electrical and optical properties of thin films through the precise use of germanium sputter targets opens up new possibilities for innovation across various fields.
Further Reading: Everything You Need to Know About Germanium Sputter Target
The properties of germanium sputter targets are critical to the success of numerous advanced technological applications. By harnessing the unique semiconducting, optical, purity, uniformity, and stability properties of germanium, scientists and engineers can push the boundaries of thin-film technology, paving the way for the next generation of electronic and optical devices. As technology continues to advance, the role of germanium sputter targets and their distinctive properties will undoubtedly grow, highlighting their importance in the ongoing evolution of materials science.
When it comes to materials for sputtering applications, niobium targets are a top choice. Their unique properties make them ideal for a range of uses, from semiconductor manufacturing to optical coatings. But how do you choose the best niobium target for your specific needs? It’s not just about buying any niobium target; it’s about finding the perfect one. Here are six signs and features to look for:
First and foremost, the purity of niobium targets is critical. The best niobium targets are ultra-high purity, often exceeding 99.99% purity. This is not just a technicality; it has a profound impact on the quality of your sputtering processes. High purity ensures minimal impurities that can negatively affect the quality of thin films and coatings. When you see a niobium target with exceptionally high purity, you’re on the right track.
The key to a successful sputtering process is uniformity and consistency. Your niobium target should be manufactured with precision. It should have a uniform composition and thickness. Variability in the target’s surface can result in uneven sputtering, which can significantly affect the quality of the deposited films. So, when examining niobium target options, look for consistency.
The density of your niobium target is another critical feature to consider. High-density targets are crucial for efficient sputtering. Why? Because they offer better thermal conductivity and stability, leading to improved target lifespan. Plus, high-density niobium targets are less prone to warping and damage, which can cause downtime during sputtering processes.
Different applications require different target shapes and sizes. What works for one industry might not be suitable for another. That’s where customization options come into play. The best niobium target suppliers offer the flexibility to customize your target’s dimensions. This ensures that the target fits your specific sputtering equipment and application requirements like a glove. Stanford Advanced Materials (SAM) offers other customized shapes and sizes of sputtering targets. You can send us an inquiry for more information.
Your niobium target should be designed for strong bonding with your sputtering equipment. The last thing you want is a target that’s difficult to mount and doesn’t stay securely in place. Targets with exceptional bonding properties ensure a stable and reliable sputtering process. They minimize the risk of target dislocation or detachment during operation, which can lead to equipment damage and production interruptions.
Quality niobium targets are one part of the equation; the other part is support. The best niobium target suppliers don’t just provide top-notch materials; they offer expert support. Whether you need technical assistance, guidance on target selection, or after-sales service, a reliable supplier is there to help you achieve optimal results. They have the expertise to answer your questions, troubleshoot any issues, and ensure that your sputtering processes run smoothly.
In conclusion, selecting the best niobium target for your applications is more than just a purchase; it’s an investment in the quality and efficiency of your sputtering processes. To find the perfect niobium target, consider factors such as purity, uniformity, density, customization options, bonding properties, and the supplier’s support. Careful evaluation of these signs and features will lead you to the ideal niobium target that meets your specific sputtering needs, ensuring your operations run smoothly and produce high-quality results.
Gold is a popular precious metal that has been used for centuries as currency, hedging and jewelry for its noble and beautiful gold color.
Gold sputtering coating is a thin film deposition process in which gold or gold alloy is bombarded with high-energy ions in a vacuum chamber, causing gold atoms or molecules to be “sputtered” into the vapor and condensed on the substrate to be coated. Sputtering is one method of the PVD (Physical Vapor Deposition) process, the other two of which are thermal evaporation deposition and electron beam vapor deposition, and gold is also applied in these two methods. In thermal evaporation deposition, gold evaporates in a low-pressure environment with resistive heating elements; and in electron beam vapor deposition, gold is heated by an electron beam, and then condensed on the substrate to be coated.
Apart from PVD coating, there are other ways for gold coatings such as gold plating and gold filling. Gold plating is a method that deposits a thin layer of gold on the surface of another metal by chemical or electrochemical plating. The advantages of gold plating are inexpensive and easy. However, the coating it produces is relatively soft and less durable, and what’s worse, its chemical process would cause pollution that is far away from environmentally friendly.
Gold filling is the mechanical bonding of gold to metal under high temperatures and pressure. It produces a thicker coating than PVD gold sputtering and gold plating, and thus it is usually more expensive.
The constant contact of skin or clothing may abrade the coatings, especially in the watch and jewelry industry. Thus, PVD gold sputtering is preferred in these two industries because the coatings it produces are harder and more durable than that of electrolytic gold plating or gold filling.
Compared to other types of gold coatings, the main advantages of PVD gold sputtering coating are their durability, retention of gloss, corrosion resistance, and abrasion resistance in contact with the skin, thus extending the life of the jewelry. PVD gold sputtering not only provides the exact color and brightness which evokes the general feeling of love and attraction with jewelry, but also has the advantage of being more environmentally friendly and durable than gold plating or gold filling for producing a gold coating.
Stanford Advanced Materials(SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs.
Tungsten, a relatively rare and exotic metal, has been widely used in many products in our daily life. Tungsten has the advantages of high melting point, high hardness, excellent corrosion resistance, and good electrical and thermal conductivity. Most of its applications are based on these properties. Tungsten is not cheap because of its scarcity, but the price of tungsten is quite reasonable compared with the prices of other rare and exotic metals.
Tungsten is an important alloying element for the aerospace industry and the industrial gas turbine industry, because it can significantly improve the strength, hardness, and wear resistance of steel.
Tungsten filament is used in incandescent bulbs to replace tantalum, which was used many years ago, as an integral part of copper and silver electrical contacts for improved wear resistance. Tungsten wire can also be used to manufacture direct heating cathodes and grids of electronic oscillation tubes and cathode heaters in various electronic instruments.
Tungsten sputtering target & Ta evaporation pellets can be used as wear-resistant coatings for mechanical parts, as evaporating filaments for physical vapor deposition (PVD) of aluminum and silver, and as key barrier electrons for barrier coatings in critical electronic devices.
Some of the other applications of Tungsten include the component of chemicals and catalysts, cutting blades, paints, pigments, inks, lubricants, etc.
Tungsten’s unique properties of heavy weight, high hardness, and high melting point make tungsten waste ideal for recycling. The fact that it is chemically resistant is a key factor in tungsten recycling. Therefore, recycling tungsten-bearing scrap is more popular. The methods of tungsten recycling can be roughly divided into the direct method and the indirect method.
Direct Tungsten Recycling
The direct method means that the tungsten waste is converted into a powder of the same composition by chemical or physical treatment or a combination of both. A typical example of a direct method is a zinc treatment method. This method has many advantages, such as limited energy consumption and chemical waste, as well as low production costs. A disadvantage of this method is the limitation on recycled materials.
Indirect Tungsten Recycling
Indirect methods, such as wet chemical processing, are commonly used in refining processes. This type of recycling has no restrictions on materials, but requires a lot of chemicals and energy.
For more information, please visit https://www.sputtertargets.net/.
Platinum and palladium are in the class of precious metals just like gold and silver in spite of little information concerning their investments. The difference is that they are not in form of currency because they are in form of industrial metal, and belong to a group called platinum metals group.
The fact that platinum is not a monetary metal confers advantages and disadvantages alike. First, it can be affected by demand issues due to its industrial nature and hence suffer massive price fluctuations sue to speculation. Secondly, it does not have the global attraction that gold and silver have as monetary metals. However, the fact that it non-monetary ensures that it is not targeted for confiscation as is the case with silver and gold. Second, the historic hart of the metal has shown that its price goes hand in hand with gold value over time even though it is more of an industrial metal. This tells you that it is a worth investment.
Related: Platinum Sputtering Target
There are a number of reputable dealers that can be contacted online. These dealers have established stores in Hong Kong, Switzerland or London. You can buy in small quantities from independent but reputable companies. For bulk buying, ensure that there is an arrangement for adequate storage because safety is of great importance. Second, you can explore mints that can produce bullion coins in the U.S, Canada, Australia, and China. The coins are available in the denominations between a tenth of an ounce and one troy ounce. Collectors tend to be more expensive than mints since most coins are regarded as collector’s items. Finally, you can consider collecting old or scrap platinum jewelry from second hand or coin shops. Another advantage of buying platinum jewelry is the authenticity and purity that comes with them.
Palladium has lesser value compared to platinum and heavily relies on industrial demand behavior. For instance, palladium is expected to be a key part of the cold fusion technology that all industrialized nations are looking up to for energy solutions. Sharp investors are eager to become part of this booming technology by investing in palladium.
Related: Palladium Sputtering Target
An investor should look at reputable independent companies to buy palladium. It is available in bars and coins. For investors that want to start small, you can start with ounces or even smaller quantities.
For more information about precious metals, please visit https://www.sputtertargets.net/.
The copper sputtering target is a coating material made of metallic copper, which is suitable for DC bipolar sputtering, three-pole sputtering, four-stage sputtering, radio frequency sputtering, counter target sputtering, ion beam sputtering, and magnetron sputtering, etc. It can be applied to manufacture reflective films, conductive films, semiconductor films, capacitor films, decorative films, protective films, integrated circuits, displays, and etc. Compared with other precious metal sputtering targets, the price of copper targets is lower, so the copper target is the preferred target material under the premise of satisfying the function of the film layer.
If you are looking for more details, kindly visit Rotary Metal Sputtering Targets.
Copper sputter targets are divided into the planar copper target and rotary copper target. The former is sheet-shaped, with round, square, and the like; the latter is tubular, and the utilization efficiency is high.
High-purity copper sputter targets are mainly used in electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devices, etc.; they can be applied to the field of glass coating; they can also be applied to wear-resistant materials, high-temperature corrosion resistance, high-end decorative supplies and other industries.
Information storage industry: With the continuous development of information and computer technology, the demand for recording media in the world market is increasing, and the corresponding target media for recording media is also expanding. Related products include hard disks, magnetic heads, and optical disks. (CD-ROM, CD-R, DVD-R, etc.), a magneto-optical phase-change optical disc (MO, CD-RW, DVD-RAM).
Integrated circuit industry: In the field of semiconductor applications, sputtering targets are one of the main components of the world target market. They are mainly used for electrode interconnect film, barrier film, contact film, optical disk mask, capacitor electrode film, and resistive film, etc.
Flat-panel display industry: Flat panel displays include liquid crystal displays (LCDs), plasma displays (PDPs), and the like. At present, LCD is the main market in the flat panel display market, and its market share exceeds 85%. LCD is considered to be the most promising flat display device and is widely used in notebook monitors, desktop monitors and high definition televisions. The manufacturing process of the LCD is complicated, in which the reflective layer, the transparent electrode, the emitter and the cathode are all formed by a sputtering method, and therefore, the sputtering target plays an important role in the manufacture of LCD.
For more information, please visit https://www.sputtertargets.net/.
To use these charts, locate the material for which known conditions are available. Then multiply the rate by the relative factors to arrive at the estimated rate for the new material. For example, with previous data showing 3.5A/s aluminum at l00W, then titanium at similar conditions will generate approximately (0.53/1.00) • 3.5 Å/s ≅ 2 Å/s.
The rates in this table are calculated based on a 500V cathode potential. As the power is increased greater than two times the original rate, the relative rate will drop slightly (up to 10%). For example, aluminum at 250W.
Al250W = 0.9 • AI100W • (P1/P0)
0.9 • 3.5 Å/s • (250/100) ≅ 7.4 Å/s
The rates in the ceramics table assume the use of an RF power supply and account for the partial duty cycle of the RF generator as compared to a DC supply. A pulsed DC supply will yield slightly higher effective rates.
The magnetic materials table shows the rate for DC operation with a new target. As the magnetic target erodes, the influence of the remaining material on the magnetic confinement field will change, leading to variations in sputter rate, operation voltage, and ignition pressure.
This information is for general planning purposes only. The Kurt J. Lesker Company makes no guarantees of the correctness of these numbers in your process. Contact the Kurt J. Lesker Company for specific assistance in setting up your process.
NON-MAGNETIC MATERIALS* Material Name Rate Ag Silver 2.88 Al Aluminum 1.00 Au Gold 1.74 Be Beryllium 0.21 C Carbon 0.23 Cu Copper 1.42 GaAs Gallium Arsenide {100} 1.03 GaAs Gallium Arsenide {110} 1.03 Ge Germanium 1.50 Mo Molybdenum 0.66 Nb Niobium 0.76 Pd Palladium 1.77 Pt Platinum 1.00 Re Rhenium 0.84 Rh Rhodium 1.16 Ru Ruthenium 0.98 Si Silicon 0.60 Sm Samarium 1.74 Ta Tantalum 0.67 Th Thorium 1.31 Ti Titanium 0.53 V Vanadium 0.50 W Tungsten 0.57 Y Yttrium 1.53 Zr Zirconium 0.88* All rates in this table are relative to aluminum.
OXIDES AND CERAMICS Material Name Rate Al2O3 Alumina 0.05 SiC Silicon Carbide 0.22 SiO2 Silicon Dioxide 0.21 Tac Tantalum Carbide 0.09 Ta2O5 Tantalum Pentoxide 0.39 MAGNETIC MATERIALS Material Name Mag Moment Rate Co Cobalt Low 0.73 Cr Chromium Med 0.87 Fe Iron High 0.57 Mn Manganese Med 0.14 Ni Nickel Low 0.86 Ni80Fe20 Permalloy High 0.80There are a few ways that you can increase/ maximize the sputtering rate of materials;
1. Increase power: While each material will be limited in their max power relative to their material properties, the cooling efficiency will allow you to operate the target at the highest possible power density. The first thing you should do is directly cool the target material by utilizing either a bolt-on style or bonded target configuration. This in addition to the aid of a conductive paste or epoxy will maximize the thermal conductivity and allow you to increase the power density to the maximum level attainable by the target material.
2. Decrease source-substrate distance: The closer the target to the substrate, the higher the sputtering rate will be. Generally, the plasma will be contained within 2" above the target surface. Many sputtering applications utilize a 3"-4" source-substrate distance. Assuming a 4" source-substrate distance, the sputtering rate will fall off by approximately 25% for every inch beyond 4". However, the rate will typically increase by approximately 35% for every inch closer you go from 4" away.
3. Lower operating pressures: In sputtering, the more gas in the chamber, the more atom and ion collisions there will be. These collisions will reduce the rate at which material atoms eject from the target surface and deposit onto the substrate. By reducing the operating gas flow, these collisions will be reduced and will have a positive impact on the ultimate sputtering rates that can be achieved.
4. Increase the number of magnetrons in the chamber: Rates will scale linearly by the number of magnetrons that are added to your application. In production applications with specific yield requirements, once the power and source-substrate parameters have been fully maximized, increasing the number of magnetrons is a parameter that can be utilized to enhance sputtering rates.
Enhancing uniformity in sputtering applications involves many variables. Some of these variables are impacted by the magnetron itself, but many are related to the system/ chamber design and flow dynamics, which in some cases cannot be controlled. However, there are a number of techniques that can be done to enhance uniformity in your application. The following list of examples provides some suggestions on what parameters can be adjusted to have a positive impact on uniformity. It is important to first recognize the fact that there are two significantly different deposition configurations that will yield much different suggestions for uniformity enhancement. As a result, we will cover these independently.
Figure 2
Figure 1
When sputtering a static substrate the following parameters will impact the overall coating uniformity;
1. Magnetron to substrate orientation: The magnetron and substrate should be centered on their axis for optimal uniformity.
2. Magnetron Size: The target should be larger than the substrate for optimal uniformity. The typical coating profile will fall off on the edges and be most uniform in the center (as figure 1).
The more overhang you have on the substrate, the more uniform the coating will be.
3. source-substrate distance: If magnetron to substrate overhang is non-existent or limited due to existing chamber design or equipment, increasing the source-substrate distance will help improve uniformity. The further away you get, the more collisions between the argon ions, electrons, and material atoms, which creates randomization on the sputtered film depositing on the substrate and ultimately better uniformity. However, the drawback to this is that the further away you are from the substrate, the lower the sputtering rates will be.
4. Masking: Masking is a technique that can be used to enhance uniformity by blocking or preventing material on certain areas of the target from depositing onto the substrate. For example, it is typical for material build-up to fall off at the edges of the target due to the magnetic field profile, active erosion zone location, and resultant flux profile. By inserting masking at the center portion of the target, you can ultimately flatten out the erosion profile (see figure 2).
When coating a rotating substrate, the following techniques can be used to enhance the uniformity;
1. Off-axis or Confocal magnetron to substrate orientation: The main advantage of rotating the substrate is that you can use a much smaller magnetron to achieve optimal uniformity by off-setting the center line of the target to the substrate. Utilizing a single axis rotation of the substrate is required for the following techniques;
Note: Adjustments to the angle and source-substrate distance may be required based on chamber design and flow dynamics.
In a confocal orientation, the following uniformities can be achieved with 3" magnetrons;
Substrate Size Uniformity 4" OD +/- 1-2% 6" OD +/- 3-5% 8" OD +/- 7%In confocal or off-axis sputtering, multiple magnetrons can be used for co-sputtering of multiple layers of variable materials and or increasing sputtering rates of the same target material.
Typically, when sputtering a 6" substrate wafer, it is possible to mount up to (4) four sputtering cathodes at a 4" source-substrate distance. It is critical to have the ability to adjust source-substrate distance and the angle of the sputtering cathode to have maximum ability to dial in uniformity.
In off-axis sputtering, having the ability adjust the off-set to the substrate, angle of the source, and source-substrate distance, are all critical parameters in dialing in the uniformity. Below are some examples of how adjusting these variables make a significant impact on both uniformity and rate;
Configuration 1 Substrate: 6" Off-Set: 3" (Center of target - Center of Substrate) source-substrate distance: 4" Head Angle: 0 deg. Target Material: Aluminum Uniformity: +/- 4.7% Rate: 4.5 Angstroms/ sec. Configuration 2 Substrate: 6" Off-set: 3" (Center of target - Center of Substrate) source-substrate distance: 4" Head Angle: -5 deg. Target Material: Aluminum Uniformity: +/- 2.2% Rate: 3.5 Angstroms/ sec. Configuration 3 Substrate: 6" Off-set: 3.5" (Center of target - Center of Substrate) source-substrate distance: 3" Head Angle: -5 deg. Target Material: Aluminum Uniformity: +/- 3.5% Rate: 5.5 Angstroms/ sec. Configuration 4 Substrate: 6" Off-Set: 3.5" (Center of target - Center of Substrate) source-substrate distance: 4" Head Angle: 0 deg. Target Material: Aluminum Uniformity: +/- 1.3% Rate: 3.6 Angstroms/ sec. Configuration 5 Substrate: 6" Off-Set: 4.25" (Center of target - Center of Substrate) source-substrate distance: 3" Head Angle: 15 deg. Target Material: Aluminum Uniformity: +/- 2.5% Rate: 2.8 Angstroms/ sec. Configuration 6 Substrate: 6" Off-Set: 4" (Center of target - Center of Substrate) source-substrate distance: 6" Head Angle: -5 deg. Target Material: Aluminum Uniformity: +/- 1.9% Rate: 0.9 Angstroms/ sec.Note: All configurations above assume single axis substrate rotation.
When sputtering dielectric targets using RF power, it is quite possible for the maximum deposition rate on the substrate to be less than 0.1 Å/sec. That is, depositing a film 100nm thick may take over 2.5 hours. It is no surprise, therefore, that we are frequently asked, "How can I increase the sputter rate?"
Actually, what the questioner wants is to increase the deposition rate, but we're not about to argue semantics with a frustrated researcher.
(But to segue into semantics for a moment: we will use sputters the adjectival form, as in sputter yield, sputter rate, sputter gun, rather than sputtering yield etc.)
In this issue we review ways to increase deposition rates and look at conditions where maximizing one parameter inadvertently affects something else.
While the substrates can be static or rotating, these suggestions apply only to circular sputter guns with flat disc targets and stationary magnet assemblies. Sputter guns with targets of other shapes and configurations, moving magnet assemblies, and linear sputter guns, have their own performance attributes that are not directly addressed here.
First, we must understand that each material has its own characteristic sputter yield - the number of atoms (or molecules) leaving the target for each ion that hits it. The sputter yield value depends on: the material; the mass of the incoming ion; the voltage through which the ion is accelerated; and its angle of incidence on the target.
For Ar+ ions striking a target at 45° through a potential of 500eV, the sputter yields of most elements are between 1 - 10, roughly.
Materials that are chemical compounds such as oxides can have much lower sputter yields! For example, Maissel and Glang's book Handbook of Thin Film Technology quotes the sputter yield for SiO2 as 0.13 and Al2O3 as 0.04.
Extending the concept of sputter yield, we will later refer to a material's sputter rate, which is its sputter yield multiplied by the ion current to the target.
Power & Power DensityAlthough we quote the power applied to a target, the critical quantity is really power density, which is the power applied divided by the target's surface area. Let us suppose the target in a 5cm (2") gun accepts 100W maximum power. Then, how can the same target material in a 10cm (4") gun accept 400W?
The table shows that despite the large change in maximum power, the two targets have identical power densities.
Diameter
cm
5
10
Area
cm2
19.6
78.5
Power
W
100
400
Power Density
W/cm2
100/19.6 = 5.1
400/78.5 = 5.1
Reducing the target-to-substrate distance (often called throw distance) is a simple, direct way to increase deposition rate. To fully understand this effect, the angular distribution of sputtered particles must be known. Regrettably, this is a complex subject since material is ejected from a circular 'trench' around the target and terms like over-cosine and under-cosine are used in the literature to describe a sputtered material's flux distribution.
For these notes, however, it is sufficient to understand that the sputtered particles' arrival rate (per unit area of substrate) varies as the inverse square of the throw distance. That is, halving the throw distance quadruples the material's arrival rate at the substrate and the film's thickness grows at 4x the previous rate!
However, it is important to consider the shorter throw distance's affect on the film's (thickness) uniformity. If, for example, material leaves the target in roughly a cosine distribution pattern, then the larger the throw distance, the higher the number of thermalizing collisions between sputtered atoms and sputter gas atoms. These collisions tend to 'flatten out' the cosine distribution making the deposition more uniform across the substrate. Since a shorter throw distance means fewer collisions, film uniformity at shorter distances may be worse.
In addition, at shorter throw distances substrates may see: higher energy sputter particles; more stray electrons; more plasma ions and 'hot' neutrals; and higher thermal radiation heat transfer from the plasma and target surface. So the adverse effects of a shorter throw distance include:
However, shorter throw distances (and, therefore, higher substrate temperatures) can have beneficial effects too:
Doubling the power applied to the target roughly doubles the sputter rate and this always appears to be the 'easy option' when faced with low deposition rates.
Unfortunately, arbitrarily increasing power has many adverse effects.All power applied to the gun must dissipate somewhere in the system. It is claimed that roughly 75% ends up heating the gun's cooling water. That is, 75% of the total power dumped into the target's front face must transfer through the target to reach the water! Clearly, the target's thermal conductivity, thermal coefficient of expansion, mechanical strength characteristics, and melting point, are critical issues.
Another major concern is the 'thermal conductance' of the interface between the target's rear face and the sputter gun's cooling well. Results tabulated in A Heat Transfer Textbook by Lienhard & Lienhard indicate the thermal conductance between two lightly clamped, flat metal surfaces is (a) not very high, and (b) depends significantly on air between the surfaces.
Evacuate that interface - that is, put the sputter gun under operating conditions - and the thermal conductance of the interface between the target and the cooling well may drop to 1/20th to 1/50th of its 'with air' value.
Some target materials are so fragile they crack no matter what sputter power is used. Bonding such materials to copper backing plates may allow their continued use even though cracked. However, if pieces chip off or the cracks become wide enough to expose bonding agent or copper backing plate, the target must be replaced.
Too high sputter power is the most common cause of target and sputter gun damage. Given the target/interface thermal limitations, such damage can be reduced/eliminated by using an appropriate maximum power (see Maximum Power Levels). However, 'appropriate' often equates to 'low' and low power means low deposition rates.
One final point about applying power to a target. Once the appropriate power has been established for a given target/gun, never switch on and immediate increase power to that value! Always increase power slowly to its maximum value through a series of ramps and soaks.
Maximum Power LevelsSo, how do I find the 'appropriate maximum power' for my target?
With patience and a 'trick'. The first time a new target material is sputtered, slowly ramp the power until the power density (see Power & Power Density) on the target is:
Let the target soak for a minute or two at whatever power that turns out to be. Then slowly increase power (not power density) by 5W and monitor the voltage for another minute. If it remains stable, ramp up another 5W and watch it for another minute.
Continue these 5W ramp/1 minute voltage monitoring steps until the voltage starts to rise. Immediately back off the power by 5W and monitor the voltage. If it remains stable for 5 minutes, you have found the appropriate maximum power for that target in that sputter gun. If, however, the voltage still rises, back off in further increments of 5W until it does stabilizes. (But note Caveat to the Trick.)
Motto: If in doubt when starting out, make it your propensity to lower power density!
Lowering the sputter gas pressure causes a modest increase in deposition rate by a two-fold mechanism:
One potential side-effect of lowering the gas pressure is a change in film uniformity. Whether it improves or worsens is typically not predictable because there are many factors involved. But one obvious aspect is a reduction in the number of thermalizing collisions.
An adverse effect of lower gas pressure/higher plasma-to-target voltage combination is the greater likelihood of arcs occurring near the target.
As a method of increasing deposition rate, this option is not easily implemented and is expensive since it requires a new sputter gun, sufficient room to install it in the chamber, and possibly a larger power supply.
For a given power density (see Power & Power Density), the larger the target diameter the higher the sputter rate. The explanation is simple. A larger target diameter means a larger sputter trench area and, for a given power density, increased trench area means increased sputter rate.
The majority of R&D deposition systems have more than one sputter gun installed. Typically, the user installs different target materials in each gun. However, putting the same target material on two or more guns and operating them simultaneously can double, triple, etc. the sputter rate and resulting deposition rate.
The drawback is, many multi-gun systems were not built for co-deposition work and have just one power supply. Buying additional supplies for simultaneous operation may make this option expensive.
Caveat to the TrickReactive metal targets such as Al and Mg are initially covered by a thin oxide coating. Before that layer 'burns' off, the target will arc, spit, and most importantly, run at a low voltage. Once that oxide layer has gone, the voltage will rise sharply to a new level.
It is this 'clean target' voltage level that you are trying to stabilize with the trick - not the initial low voltage.
Yes, there are ways to increase deposition rates. Unfortunately the easy winding-up-the-power option, if misused, at best leaves your targets looking a little sad. At worst, your sputter gun splutters to a stop, water leaks into the chamber, or the power supply fries. No, I jest! At worst, all three happen simultaneously.
As always, if you have questions or comments and they will be forwarded to the author.
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