This article will tell us how to get a uniform, smooth, wear-resistant and rust-proof nickel layer on the surface of copper parts.
Author: Marisa
I. Pretreatment
1. Substrate treatment: The surface of the copper part must be degreased, decontaminated, pickled and other treatments to ensure that the surface of the substrate is clean and free of pollutants such as oil and oxide layer.
2. Copper layer removal treatment: Since the surface of the copper part is already copper, it is not conducive to the growth and adhesion of metal nickel plating, so the copper layer needs to be etched to better adhere to the electroplating layer.
3. Activation treatment: Through activation treatment, the chemical properties of the surface of the sheet can be changed, which is more conducive to the adsorption of chemical components by the plating solution, and improves the metal adhesion and wear resistance of the coating.
II. Preparation of plating solution
1. Preparation of stock solution: The chemical reagents are prepared into plating solution according to a certain proportion. Generally, the formula and quality of the plating solution are guaranteed by electrochemical testing and quality control to ensure the stability and adhesion of the plating solution.
2. Plating solution condition regulation: By regulating the temperature, acidity, current density, metal ion concentration and other parameters of the plating solution, the chemical composition of the plating solution is stable, and the electroplating quality and surface finish of the coating are guaranteed.
III. Electroplating quality control
1. Current density control: During the electroplating process, current density control determines the formation of horizontal grains and the formation of the electroplated layer. By adjusting the current density, horizontal or vertical grains and grain growth in different directions can be obtained.
2. Voltage control: Voltage control can effectively affect the diffusion rate and deposition rate of the electrolyte to regulate the thickness and composition of the coating and improve the uniformity and surface quality of the electroplated layer.
3. Hydrogen exposure control: In the plating solution, the generation of hydrogen also has a certain impact on the quality of electroplating. Therefore, by controlling the time and intensity of hydrogen exposure, defects such as burrs and pitting on the surface of the coating can be effectively avoided.
IV. Electroplating quality inspection
1. Appearance inspection: It is mainly visual inspection. The quality of chemical nickel plating of copper parts can be comprehensively judged by indicators such as surface gloss, thickness and finish of the coating.
2. Chemical composition detection: The elemental composition of chemical nickel plating of copper parts can be detected and analyzed by analytical methods such as X-ray diffraction and Raman spectroscopy to ensure the stability and uniformity of the coating composition.
3. Mechanical properties test: including hardness test, wear resistance test and corrosion resistance test, etc., to detect whether the mechanical properties of copper parts chemical nickel plating meet the requirements.
Through the above steps of copper parts chemical nickel plating process, it can ensure that the surface of the copper parts is uniform, smooth, wear-resistant and rust-proof. The electroplating layer is suitable for use in various fields and is a commonly used metal surface treatment method.