Previously, we have introduced Four main molding methods for ITO targets, mainly about their definitions and characteristics. And today I think it necessary to talk about the advantages and disadvantages of each method, which is helpful for you to make choices between them when you want to prepare ITO targets.
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Hot Pressing
The hot pressing method is a simultaneous process of press molding and heat sintering, and the advantages of this process are:
(1) During the process of hot pressing, since the powder is in a thermoplastic state, the deformation resistance is small, and plastic flow and densification are easy, so the required molding pressure is small. (2) Simultaneous heating and pressurization help the contact, diffusion and flow between the powder particles, reduce the sintering temperature and shorten the sintering time, and suppress the growth of crystal grains. (3) The hot pressing method can easily obtain a sintered body which is close to the theoretical density and whose porosity is close to zero, and it is easy to obtain a fine grain structure.
The main disadvantages of this method are: (1) The obtained target size is small due to the limitation of the hot pressing equipment and the size of the mold. The current maximum size of the target is 400 × 300mm. (2) This method has high requirements on mold materials (generally high-purity high-strength graphite). Moreover, the hot pressing equipment needs to be imported, and is not suitable for industrial continuous production. The production efficiency is low and the cost is high. (3) The uniformity of the target grain is poor.
Hot isostatic pressing
Hot isostatic pressing is the most common method for preparing ITO sputtering targets. It has the following advantages: (1) It can overcome the disadvantages of hot pressing in a graphite mold. (2) In the heated and pressurized state, the product is simultaneously pressed in all directions, so that the obtained product has a very high density (almost a theoretical density). (3) The hot isostatic pressing strengthens the pressing and sintering process and lowers the sintering temperature, thereby avoiding grain growth, so that the product can obtain excellent physical and mechanical properties.
The disadvantages are: (1) The size of the target is limited by the pressure of the equipment and the size of the cylinder, and it is difficult to prepare a large-sized target. (2) The equipment is expensive and the investment cost is high. (3) Low production efficiency and high production cost make the product uncompetitive.
Room temperature sintering
The main advantages of the room temperature sintering method are: (1) The size of the target is not limited by the equipment, so it is possible to produce a large-sized target. (2) Low equipment investment, low production cost, high production efficiency, excellent target performance, and easy industrial production. (3) This method is suitable for the performance requirements of coated targets for high-end displays.
Its weaknesses are: (1) This method is the most difficult sintering method compared with other methods. To obtain a dense sintered body, it is often necessary to add a sintering aid. However, the sintering aid is difficult to remove from the sintered body, thus lowering the purity of the product. (2) The shape, particle size and particle size distribution of the powder are strictly required. In order to meet the requirements, the powder is generally subjected to ball milling, jet milling and sedimentation classification. (3) The target produced is generally thin.
Cold isostatic pressing
The advantages of cold isostatic pressing for the preparation of ITO targets are: (1) Compared with mechanical pressing, since the pressure of cold isostatic pressing is large and the workpiece is uniformly stressed, it is particularly suitable for pressing large-sized powder products. (2) The pressed powder product has the advantages of high density and uniformity. (3) The pressed powder does not require the addition of a lubricant or the like. (4) Its production cost is low and it is suitable for mass production.
However, the use of hyperbaric oxygen makes the process dangerous.
Sputter coating might sound complex, but the basic idea is simple: it’s a process that uses energy to turn a solid material into a thin, even coating on another surface.
Here’s how it works:
Everything starts inside a vacuum chamber, where the air is removed to keep the environment clean and controlled. Inside this chamber, there are two main parts: a sputtering target (the material you want to coat with) and a substrate (the surface you want to coat).
A gas—usually argon—is pumped into the chamber. When a high voltage is applied, the argon gas turns into a plasma. This plasma is full of energized particles that rush toward the sputtering target. When these particles hit the target, tiny atoms are knocked off.
These atoms travel across the chamber and settle evenly onto the substrate, creating a thin film layer.
It’s a bit like spray painting at the atomic level—only much cleaner, more precise, and done in a vacuum.
One of the great things about this process is how accurate and consistent it is. You can control the thickness of the film down to just a few nanometers (that’s thousands of times thinner than a human hair!). This makes sputter coating ideal for building advanced electronics, sensitive optical layers, or even medical implants where quality and performance matter.
There are also different types of sputtering—like DC, RF, and magnetron sputtering—that are used depending on the type of material and the desired outcome. But they all follow the same basic idea: knock atoms loose and coat a surface with them.
At AEM Deposition, we design our sputtering targets to perform perfectly under these conditions. We understand the challenges involved and offer reliable materials that help you get consistent, high-quality coatings every time.
Sputter coating isn’t just a high-tech process—it offers real, practical advantages for manufacturers, engineers, and researchers.
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Here are some of the key benefits:
High Precision and Control
Sputter coating allows you to apply films that are incredibly thin and accurate—often just a few nanometers thick. This is ideal for products that require exact material thickness, like semiconductors or optical lenses.
Uniform and Smooth Coatings
The process creates very even and consistent layers across the surface. This is critical when coating small or detailed parts where flaws or unevenness could affect performance.
Strong Adhesion
Thin films created by sputtering bond tightly to the surface. This makes them more durable and long-lasting, even under heat, wear, or moisture.
Wide Material Range
You can use a variety of materials for coating—metals like gold, silver, titanium, or oxides like indium tin oxide (ITO). That means you can create coatings for electrical, optical, or protective purposes.
Clean and Contamination-Free
Because it’s done in a vacuum, the process is extremely clean. This helps achieve high-purity coatings, which is essential in fields like microelectronics or medical devices.
Environmentally Friendly
Compared to some chemical coating methods, sputter coating is cleaner, with fewer hazardous byproducts.
In short, sputter coating gives you control, quality, and flexibility. It’s a go-to method when performance matters most.
At AEM Deposition, we help clients unlock these benefits by supplying high-quality sputtering targets made for demanding environments. Whether you're working on electronics, optics, or next-gen technology, our materials are built to deliver results.
At AEM Deposition, our sputtering targets power innovation across a wide range of industries. From everyday electronics to advanced aerospace systems, our materials help manufacturers and researchers produce high-quality thin films with confidence.
Here’s a closer look at the key industries we support:
We supply sputtering targets used in the production of microchips, sensors, printed circuit boards (PCBs), and resistive layers. These applications demand precision and purity, and our materials deliver reliable, consistent results. Whether you’re manufacturing high-frequency devices or developing cutting-edge MEMS, we provide the right materials for the job.
Popular materials: Titanium, Nickel, Chromium, NiCr alloys
Modern displays, such as OLEDs, LCDs, and touchscreens, rely heavily on thin films. Our oxide and ceramic targets are used in transparent conductive layers and optical coatings that enhance clarity, brightness, and durability.
Popular materials: Indium Tin Oxide (ITO), Aluminum Oxide, Zinc Oxide, AZO
In solar cell production, sputter coatings are used to improve light absorption, conductivity, and efficiency. We work with solar companies and R&D labs to supply materials that support next-generation energy technologies.
Popular materials: Molybdenum, Aluminum, AZO, ZnO
Companies in the optics sector use sputtering targets to deposit anti-reflective coatings, mirror finishes, and hard protective layers on glass and plastic surfaces. These coatings improve performance in cameras, lenses, eyewear, and scientific instruments.
Popular materials: Titanium Dioxide, Aluminum, Chromium
In the medical field, coatings enhance biocompatibility, corrosion resistance, and device longevity. Our high-purity metal targets support the production of surgical instruments, implants, and diagnostic tools.
Popular materials: Titanium, Aluminum Oxide
For aerospace and defense, durability is non-negotiable. Our sputtering targets are used in radar systems, IR optics, protective barriers, and space components that must perform in extreme environments.
Popular materials: Tungsten, Molybdenum, Titanium
We’re proud to support researchers working on everything from nanotechnology to material discovery. Our flexible order sizes and custom formulations make us a trusted partner for R&D labs and academic institutions.
Contact us to discuss your requirements of titanium sputtering targets. Our experienced sales team can help you identify the options that best suit your needs.